Description
- Thermal Interface Pad
- Self−Adhesive Pad
- 1.65” x 1.65” Square
- 0.08°C−in2/W Thermal Impedance
- High Visibility Protective Tabs
NTE Electronics NTE425 1.65" Self−Adhesive Thermal Interface Pad
The NTE425 is designed as a pressure sensitive, thermal interface material for use between a high performance processor and a heat sink. NTE425 is a thermally conductive, inherently tacky, +55°C phase change composite supplied on a polyester carrier liner with high visibility protective tabs.
Features
Typical Applications:
The NTE425 is designed as a pressure sensitive, thermal interface material for use between a high performance processor and a heat sink. NTE425 is a thermally conductive, inherently tacky, +55°C phase change composite supplied on a polyester carrier liner with high visibility protective tabs.
Features
- Thermal Impedance: 0.08°C−in2/W (@ 25psi)
- Inherently Tacky, +55°C Phase Change Composite
- High Visibility Protective Tabs
- Pressure Sensitive Phase Change Thermal Interface Material
Typical Applications:
- Computer and Peripherals
- High Performance Computer Processors
- Graphics Cards
- Power Modules